TECHNOLOGY NEWS | Panel-level Advanced Packaging
SynPower Technology participates in panel-level packaging technology collaboration, supporting the development of Taiwan’s advanced packaging supply chain.
Touch Taiwan Series Exhibition｜Electronic Manufacturing Equipment Exhibition
SynPower Technology participates in panel-level packaging technology collaboration, supporting the development of Taiwan’s advanced packaging supply chain.The Department of Industrial Technology, Ministry of Economic Affairs, established an Innovation Technology Pavilion at the “Electronic Manufacturing Equipment Exhibition” of the Touch Taiwan series, showcasing a number of key technology achievements. Among them, ITRI developed the next-generation panel-level packaging metallization technology, helping panel manufacturers transform and enter the panel-level advanced packaging market while connecting Taiwan’s materials, process, and equipment supply chain capabilities.
Key Focus of Technology Collaboration
This technology overcomes the limitations of high-aspect-ratio metallization and coating, and introduces a fully wet process. It is expected to reduce equipment and process costs by 30%, providing a more competitive process solution for mass-production applications in panel-level packaging.
Driven by the demand for AI, high-performance computing (HPC), and smart manufacturing, the panel-level packaging market is regarded as an important development direction for advanced semiconductor manufacturing. The Department of Industrial Technology, Ministry of Economic Affairs, pointed out that the output value of panel-level packaging is expected to grow from USD 400 million in 2025 to USD 2 billion in 2030, showing strong growth potential.
In this technology collaboration, ITRI has worked with TPK, SynPower Technology, Chao Te International, Hsu Yu Teng Precision Technology, and other Taiwanese companies to jointly promote the deployment of domestic materials and equipment supply chains and build a panel-level packaging industry ecosystem.
As one of the domestic equipment supply chain partners, SynPower Technology will leverage its experience in wet processes, automation equipment, and smart manufacturing integration to participate in the panel-level packaging industry chain deployment, helping Taiwan’s advanced packaging supply chain improve self-reliance and international competitiveness.
SynPower Technology stated that it will continue to focus on smart manufacturing technology integration, deepen cooperation with industry and research partners, invest in high-end processes and domestic equipment supply chain development, and help Taiwan’s electronics and semiconductor industries capture new opportunities in the advanced packaging market.
