・Control the key process of reducing copper wire before/after, electroplating before etching and other key processes to control the surface copper thickness

・Automated application to reduced human factors or without vertical point-taking measurement

・Micro-resistance technology with position and contact pressure control feedback

・Measurement accuracy: ± 3% (standard film)

・Measurable chemical copper: 0.25um~12.7um

・Measurable electroplating copper: 2.5um~300um

・It can be combined with job order, data feedback and upload